For decades, chipmakers have been squeezing more transistors into smaller spaces, but this comes with growing pains. Nexstrom, a startup from Singapore, believes the answer lies in two-dimensional materials, which are much thinner than the silicon currently used. These materials, known as transition-metal dichalcogenides (TMDs), could revolutionize chip production by allowing for even smaller and more efficient chips.

The company’s flagship product, North Star, aims to grow TMDs directly on commercial chip wafers, a process previously achievable only on a small scale. Nexstrom hopes to bridge this gap, and it has raised $12 million to develop its technology further. The company is working with industry giants like TSMC, but aims to provide the tech rather than compete with them.

The challenges are significant, with the main hurdle being the consistent growth of TMDs across an entire wafer. Nexstrom is optimistic, claiming it has already demonstrated material results on 12-inch wafers and plans to complete 8-inch and 12-inch wafers by the end of October. The company expects its equipment to be ready for commercial production between 2030 and 2035.

With the global shortage of components showing no signs of easing, Nexstrom’s work could not come at a better time. If successful, its technology could pave the way for a new era of chipmaking, where thinner, more efficient semiconductors open up new possibilities in technology.